A collection of multiple unpackaged silicon dies from the ECE 5745 course tapeout project. Each die is identical in design and fabrication, containing the same integrated circuit pattern cut (diced) from the original silicon wafer. This set demonstrates various stages of the semiconductor fabrication process and serves as a valuable educational resource for understanding chip design, wafer dicing, and pre-packaging integrated circuit components.
ECE 5745 Tapeout, Many Die
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